发明名称 |
3D-IC INTERPOSER TESTING STRUCTURE AND METHOD OF TESTING THE STRUCTURE |
摘要 |
An interposer for a 3D-IC is provided with a plurality of functional metal wiring segments where the plurality of functional metal wiring segments are connected in series by a plurality of dummy metal wiring segments thus allowing the plurality of functional metal wiring segments to be electrically tested for continuity Each of the plurality of dummy metal wiring segments is provided with a laser fuse portion for disconnecting the dummy metal wiring segments upon completion of the electrical test.
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申请公布号 |
US2013106459(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201113285114 |
申请日期 |
2011.10.31 |
申请人 |
TSENG NAN-HSIN;YU CHI-YEH;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
TSENG NAN-HSIN;YU CHI-YEH |
分类号 |
G01R31/26;H05K1/11 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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