| 摘要 |
An improved method for bonding opposing parallel and perpendicular positioned electrically conductive frames or surfaces. An electrically conductive spring body formed and positioned in such a way as to provide opposing outward force to electrically adjoin the conductive frames or surfaces. The spring comprises outward facing surface penetrating contacts and surface retention springs that provide the electrical interface and positive capture of the spring to the conductive frames or surfaces. The spring can comprise a formed feature at the bottom tip of the device to capture a separate cable when the spring's tip is not being used for grounding to another surface.
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