发明名称 |
Multi Chip Modules for Downhole Equipment |
摘要 |
An electronic assembly for use in a downhole module may include a multilayer ceramic assembly and an electronic component disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes a ceramic substrate, a nickel plating layer disposed on the ceramic substrate and a gold plating layer having a thickness of less than about 0.5 microns disposed on the nickel plating layer. A wirebond such as an aluminum wirebond extends between the electronic component and the gold plating layer.
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申请公布号 |
US2013105140(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201213666868 |
申请日期 |
2012.11.01 |
申请人 |
SCHLUMBERGER TECHNOLOGY CORPORATION;SCHLUMBERGER TECHNOLOGY CORPORATION |
发明人 |
BARBARA FRANCOIS;GARANDO LAHCEN |
分类号 |
E21B41/00;B23K31/02 |
主分类号 |
E21B41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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