LIGHT EMITTING DEVICE WITH INTEGRAL SHAPED REFLECTOR

摘要

A reflective material is shaped around each LED die on a wafer, or around sets of LED dies, before the dies are singulated from the wafer. The reflective material may be a high-hardness and high-reflectivity dielectric material. A high-hardness material provides mechanical support and protection during subsequent handling of the singulated die. A high- reflectivity material reduces optical loss at the sides of the LED die, and can be shaped to provide a desired light output radiation pattern. By forming the integral reflector around each die while the dies are on the wafer, the manufacturing cost per die is reduced compared to forming individual reflectors after the dies are singulated.