发明名称 |
EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM, METALLIC FOIL CLAD LAMINATE PLATE AND MULTILAYER PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION |
摘要 |
The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:
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申请公布号 |
US2013108843(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201113700561 |
申请日期 |
2011.05.31 |
申请人 |
YANAGIDA MAKOTO;GOUZU SHUUJI |
发明人 |
YANAGIDA MAKOTO;GOUZU SHUUJI |
分类号 |
C08L63/00;B32B3/10;B32B15/092 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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