发明名称 EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM, METALLIC FOIL CLAD LAMINATE PLATE AND MULTILAYER PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION
摘要 The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:
申请公布号 US2013108843(A1) 申请公布日期 2013.05.02
申请号 US201113700561 申请日期 2011.05.31
申请人 YANAGIDA MAKOTO;GOUZU SHUUJI 发明人 YANAGIDA MAKOTO;GOUZU SHUUJI
分类号 C08L63/00;B32B3/10;B32B15/092 主分类号 C08L63/00
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