| 发明名称 |
STRUCTURE FOR HERMETIC ENCAPSULATION OF A DEVICE AND AN ELECTRONIC COMPONENT |
| 摘要 |
An encapsulation structure comprising at least one hermetically sealed cavity in which at least the following are encapsulated: a device, an electronic component produced on a first substrate, and a getter material layer covering the electronic component in order to block the gases capable of being degassed by the electronic component, and in which the device is not covered by the getter material layer.
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| 申请公布号 |
US2013105959(A1) |
申请公布日期 |
2013.05.02 |
| 申请号 |
US201213661792 |
申请日期 |
2012.10.26 |
| 申请人 |
COMMISSARIAT A I'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;COMMISSARIAT A I'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES |
发明人 |
BAILLIN XAVIER;PORNIN JEAN-LOUIS |
| 分类号 |
H01L23/26;H01L21/54 |
主分类号 |
H01L23/26 |
| 代理机构 |
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