发明名称 HEAT STABILIZED MOLDING COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide composition having better heat aging properties. <P>SOLUTION: A heat stabilized molding composition comprises: (a) a thermoplastic polyamide composition consisting of a blend of at least two polyamides; (b) a stabilizing system comprising a thermostabilizer selected from the group consisting of phenolic thermostabilizers, organic phosphites, aromatic amines, metal salts of elements from Group IB, MB, III and IV of the Periodic Table and metal halides of alkali and alkali earth metals, and combinations thereof; and (c) a metal oxide, or salt thereof, of a transition metal element from Group VB, VIB, VIIB and VIIIB of the Periodic Table, or a mixture thereof. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013079387(A) 申请公布日期 2013.05.02
申请号 JP20120266734 申请日期 2012.12.05
申请人 DSM IP ASSETS BV 发明人 RULKENS RUDY;GIJSMAN PIETER;SOUR WILHELMUS JOSEPHUS MARIA;JANSSEN ROBERT HENDRIK CATHARINA
分类号 C08L77/00;C08K3/10;C08K3/16;C08K3/18;C08K5/00 主分类号 C08L77/00
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