发明名称 COMPOSITION AND PROCESS FOR POST-ETCH REMOVAL OF PHOTORESIST AND/OR SACRIFICIAL ANTI-REFLECTIVE MATERIAL DEPOSITED ON A SUBSTRATE
摘要 A composition and process for removing photoresist and/or sacrificial anti-reflective coating (SARC) materials from a substrate having such material(s) thereon. The composition includes a base component, such as a quaternary ammonium base in combination with an alkali or alkaline earth base, or alternatively a strong base in combination with an oxidant. The composition may be utilized in aqueous medium, e.g., with chelator, surfactant, and/or co-solvent species, to achieve high-efficiency removal of photoresist and/or SARC materials in the manufacture of integrated circuitry, without adverse effect on metal species on the substrate, such as copper, aluminum and/or cobalt alloys, and without damage to SiOC-based dielectric materials employed in the semiconductor architecture.
申请公布号 US2013109605(A1) 申请公布日期 2013.05.02
申请号 US201213718830 申请日期 2012.12.18
申请人 ADVANCED TECHNOLOGY MATERIALS, INC.;ADVANCED TECHNOLOGY MATERIALS, INC. 发明人 RATH MELISSA K.;BERNHARD DAVID D.;MINSEK DAVID;KORZENSKI MICHAEL B.;BAUM THOMAS H.
分类号 C11D3/04;A61K31/44;C11D1/62;C11D7/06;G03F7/32 主分类号 C11D3/04
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