MODIFIED SILICONE RESIN COMPOSITION

摘要

The present invention relates to a modified silicone resin composition, comprising: (A) a modified polysiloxane having one or more epoxy groups per molecule; (B) a modified polysiloxane having one or more carboxyl groups per molecule; (C) an acid anhydride or a multifunctional organic acid as a curing agent; and (D) a catalyst. The resin composition of the present invention has excellent heat resistant characteristics and adhesion, and thus can provide excellent thermochromic stability and crack resistance when cured after being applied as a packaging material, a filler, an adhesive or a coating agent to electric or electronic devices such as a light emitting diode (LED).