| 摘要 |
<p>Provided is a process for metallisation of holes in a printed circuit board. A drilled printed circuit board is subjected to the following steps of treatment in succession: a board grinding treatment, a first water washing, an expanding treatment, a second water washing, removal of glue residues, a third water washing, neutralization, a fourth water washing, drying, a first micro-etching treatment, a fifth water washing, de-oiling, a sixth water washing, a first hole blackening, drying, hole conditioning, a seventh water washing, a second hole blackening, drying, a second micro-etching treatment, an eighth water washing, a board grinding treatment, a ninth water washing, an anti-oxidation treatment, a tenth water washing, drying and electroplating of copper. In the hole blackening process, the copper on the substrate is reliably connected to the electroplated copper without the problem of delamination of copper connections and has good reliability. Moreover the hole blackening process produces no impurity on the surface of the substrate, leading to good connection quality. In addition, in the hole blackening process, no formic acid or heavy metal is used, causing substantially no pollution to the environment.</p> |
