摘要 |
An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm, in ° C., and a heat of fusion, Hf, in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm≧(0.2143*Hf)+79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound. |
申请人 |
DOW GLOBAL TECHNOLOGIES LLC |
发明人 |
NAUMOVITZ, JOHN, A.;PATEL, RAJEN, M.;WU, SHAOFU;NIEMANN, DEBRA, H. |