| 摘要 |
The present invention provides a sputtering apparatus capable of ensuring a uniform film thickness of a film deposited on wall surfaces or side surface portions of a relief structure, throughout the relief structure, even on a substrate on which the relief structure is formed, as well as having the function of forming a multilayered film having a uniform film thickness on a flat substrate surface. A sputtering apparatus according to one embodiment of the present invention includes a substrate holder (22) for rotatably holding a substrate (21), a cathode unit (40) arranged at a position diagonally opposite to the substrate holder (22), a position sensor (23) for detecting a rotational position of the substrate held on the substrate holder, and a holder rotation controller (51) for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller (51) controls the rotation speed so that the rotation speed of the substrate when the cathode unit (40) is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit (40) is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate. |
