发明名称 Infrared solid-state imaging device
摘要 A thermal infrared solid-state imaging device includes a horizontal scanning circuit for scanning a pixel area horizontally to read an infrared image, and vertical scanning circuits provided at both ends of the pixel area. The vertical scanning circuits drive a drive line by applying a driving voltage at both ends of the drive line (in two-end driving). Further a bias voltage is applied at the end of the pixel area to a bias line connected to differential integrating circuits.
申请公布号 US8431900(B2) 申请公布日期 2013.04.30
申请号 US201113035173 申请日期 2011.02.25
申请人 ONAKADO TAKAHIRO;UENO MASASHI;MITSUBISHI ELECTRIC CORPORATION 发明人 ONAKADO TAKAHIRO;UENO MASASHI
分类号 G01J5/20 主分类号 G01J5/20
代理机构 代理人
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