发明名称 |
Infrared solid-state imaging device |
摘要 |
A thermal infrared solid-state imaging device includes a horizontal scanning circuit for scanning a pixel area horizontally to read an infrared image, and vertical scanning circuits provided at both ends of the pixel area. The vertical scanning circuits drive a drive line by applying a driving voltage at both ends of the drive line (in two-end driving). Further a bias voltage is applied at the end of the pixel area to a bias line connected to differential integrating circuits. |
申请公布号 |
US8431900(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US201113035173 |
申请日期 |
2011.02.25 |
申请人 |
ONAKADO TAKAHIRO;UENO MASASHI;MITSUBISHI ELECTRIC CORPORATION |
发明人 |
ONAKADO TAKAHIRO;UENO MASASHI |
分类号 |
G01J5/20 |
主分类号 |
G01J5/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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