发明名称 |
Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
摘要 |
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer. |
申请公布号 |
US8431222(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US20070829406 |
申请日期 |
2007.07.27 |
申请人 |
PAUL SANKAR K.;WORLD PROPERTIES, INC. |
发明人 |
PAUL SANKAR K. |
分类号 |
B32B27/08;B05D1/40;B32B15/08 |
主分类号 |
B32B27/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|