POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
摘要
<p>Polishing pads for polishing semiconductor substrates using eddy current end- point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.</p>
申请公布号
SG188632(A1)
申请公布日期
2013.04.30
申请号
SG20130021274
申请日期
2011.09.28
申请人
NEXPLANAR CORPORATION
发明人
ALLISON, WILLIAM C.;SCOTT, DIANE;HUANG, PING;FRENTZEL, RICHARD;SIMPSON, ALEXANDER, WILLIAM
