| 摘要 |
The present invention relates to a package for a light-emitting diode element and to a production method therefor, and more specifically relates to: a package for a light-emitting diode element of high efficiency having an integrated heat-dissipating reflector plate able to reflect the light which is generated from the light-emitting diode element while at the same time dissipating the heat which is generated from the light-emitting diode element; and to a production method therefor. The package for a light-emitting diode element having the heat-dissipating reflector plate according to the present invention comprises a printed circuit board and a heat-dissipating reflector plate of a metal material which is integrally joined to the printed circuit board. The printed circuit board takes the form of a printed circuit board having a first metal layer in which a ground pattern is formed, and an insulating layer joined to the first metal layer. The heat-dissipating reflector plate takes the form of a heat-dissipating reflector plate of a metal material having a joining surface which is joined to the ground pattern of the first metal layer, and a reflective surface which extends to a predetermined height from the joining surface and surrounds a light-emitting diode. The ground pattern of the first metal layer of the printed circuit board and the heat-dissipating reflector plate are joined by means of hot pressure bonding. When the present invention is employed, the heat generated from the light-emitting diode is conducted to the first metal layer, and the heat conducted to the first metal layer is rapidly conducted to the heat-dissipating reflector plate joined thereto by means of hot pressure bonding and is emitted to the exterior therefrom. Consequently, the package for a light-emitting diode element according to the present invention can be fitted with a high-output light-emitting diode element of 2.0 Watts or more. |
