| 摘要 |
PURPOSE: A photosensitive resin composition is provided to ensure excellent masking by high coloration and form a solder resist layer having high resolution. CONSTITUTION: A photosensitive resin composition comprises a perylene based coloring agent and a resin containing carboxylic acid. A dry film is obtained by applying the photosensitive resin composition on a carrier film and drying. A cured product is produced by hardening the dry film on circuit formed-substrate. The print wiring substrate comprises a solder resist layer comprising the cured product on the circuit formed substrate. |
