METHOD OF PREPARING GOLD NANOSTRUCTURE USING THE ELECTRODLESS DISPLACEMENT PLATING METHOD

摘要

PURPOSE: A manufacturing method for gold nanostructure using an electroless displacement plating method are provided to uniformly manufacture gold nanostructure on a large area, to manufacture without other mediators, and to facilitate to manufacture gold nanostructure without applying electric energy. CONSTITUTION: A manufacturing method for gold nanostructure using an electroless displacement plating method comprises the following steps: forming a metal layer by evaporating a metal with lower reduction potential than gold to a substrate; and reacting a plating solution which contains gold ions with the metal layer. The metal with lower reduction potential than gold indicates Ni, Pt, Ag, or Cu. The gold nanostructure is a nanoflower or nanolawns structure. [Reference numerals] (AA) Plating solution; (BB) Reaction in the solution; (CC) Seed metal ion; (DD) Au ion; (EE) Metal; (FF) Substrate; (GG) Metal nanostructure;