发明名称 |
Packages and Methods for Forming the Same |
摘要 |
A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size. |
申请公布号 |
US2013099385(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201113280157 |
申请日期 |
2011.10.24 |
申请人 |
CHEN MENG-TSE;LIN CHUN-CHENG;TSAI YU-PENG;LIN HSIU-JEN;CHENG MING-DA;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN MENG-TSE;LIN CHUN-CHENG;TSAI YU-PENG;LIN HSIU-JEN;CHENG MING-DA;LIU CHUNG-SHI |
分类号 |
H01L23/538;H01L21/66 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|