发明名称 |
METHOD OF FABRICATING A WIRING BOARD |
摘要 |
A method of fabricating a wiring board includes forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer. The method also includes forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed, and removing the support member.
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申请公布号 |
US2013097856(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213712352 |
申请日期 |
2012.12.12 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD.;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KANEKO KENTARO |
分类号 |
H05K3/00;H05K3/06;H05K3/40 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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