发明名称 |
METHOD OF MANUFACTURING SUBSTRATE FOR CHIP PACKAGES AND METHOD OF MANUFACTURING CHIP PACKAGE |
摘要 |
Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later. |
申请公布号 |
WO2013032277(A3) |
申请公布日期 |
2013.04.25 |
申请号 |
WO2012KR06999 |
申请日期 |
2012.08.31 |
申请人 |
LG INNOTEK CO., LTD.;KANG, TEA HYUK;KIM, HONG IL |
发明人 |
KANG, TEA HYUK;KIM, HONG IL |
分类号 |
H01L23/12;H01L23/10 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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