发明名称 SILICON COMPOUND CONTAINING EPOXY GROUP AND THERMOSETTING RESIN COMPOSITION
摘要 The present invention relates to an epoxy group-containing silicon compound which is obtained by condensing at least one epoxy group-containing alkoxy silicon compound per se represented by the general formula (1a): R1aSi(OR2)3, wherein R1a denotes a substituent having an epoxy group and R2 denotes an alkyl group having at most 4 carbons, or said compound and at least one substituted alkoxy silicon compound represented by the general formula (1b): R1bSi(OR3)3, wherein R1b denotes an alkyl group having at most 10 carbons, an aryl group or an unsaturated aliphatic residue and R3 denotes an alkyl group having at most 4 carbons, in the presence of a basic catalyst. <IMAGE>
申请公布号 KR101256783(B1) 申请公布日期 2013.04.25
申请号 KR20117022274 申请日期 2004.02.10
申请人 发明人
分类号 C08G59/02;C08G77/14;C08L63/00;C08L83/06 主分类号 C08G59/02
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