发明名称 |
Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV |
摘要 |
A stacked integrated circuit (IC) device with at least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) including a tip protruding beyond the bottom surface to a tip length is provided. The tip has an outer dielectric tip liner, and an electrically conductive portion within the outer dielectric tip liner. A compliant layer is applied to the bottom surface of the IC die. The dielectric tip liner is removed from a distal portion of the tip to expose an electrically conductive tip portion. A solder material is deposited on the exposed distal portion of the tip. The solder material is reflowed and coalesced to form a solder bump on the distal portion of the tip.
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申请公布号 |
US2013099384(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213443310 |
申请日期 |
2012.04.10 |
申请人 |
SIMMONS-MATTHEWS MARGARET R.;ABBOTT DONALD C.;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
SIMMONS-MATTHEWS MARGARET R.;ABBOTT DONALD C. |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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