| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic equipment which can be miniaturized. <P>SOLUTION: According to one embodiment, electronic equipment includes a housing, a first heat radiation part housed in the housing, a second heat radiation part housed in the housing, a first heat pipe thermally connected to the first heat radiation part, a second heat pipe having a part crossing the first heat pipe and thermally connected to the second heat radiation part, and a fan for fanning at least one between the first heat radiation part and the second heat radiation part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
