PURPOSE: A method for manufacturing a circuit board is provided to prevent a short by uniformly supplying illuminance to the inner bottom of a cavity. CONSTITUTION: A processing block layer(120) is formed in an insulation layer(110). A circuit pattern(114) and a solder resist(112) are formed on the surface of the insulation layer. A cavity(130) is formed in the insulation layer. The processing block layer is removed by etching the cavity.
申请公布号
KR20130041527(A)
申请公布日期
2013.04.25
申请号
KR20110105835
申请日期
2011.10.17
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, SEUNG LAK;KIM, BYOUNG CHAN;LEE, SANG MIN;CHO, KI HEE