发明名称 A METHOD FOR MANUFACTURING A CIRCUIT BOARD
摘要 PURPOSE: A method for manufacturing a circuit board is provided to prevent a short by uniformly supplying illuminance to the inner bottom of a cavity. CONSTITUTION: A processing block layer(120) is formed in an insulation layer(110). A circuit pattern(114) and a solder resist(112) are formed on the surface of the insulation layer. A cavity(130) is formed in the insulation layer. The processing block layer is removed by etching the cavity.
申请公布号 KR20130041527(A) 申请公布日期 2013.04.25
申请号 KR20110105835 申请日期 2011.10.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, SEUNG LAK;KIM, BYOUNG CHAN;LEE, SANG MIN;CHO, KI HEE
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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