发明名称 POLYIMIDE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyimide film having excellent heat resistance, dimensional stability represented by a heat expansion coefficient, flexibility, and high transparency together. <P>SOLUTION: The polyimide film having not less than two polyimide resin layers is a polyimide film which includes at least one layer of the polyimide film of a polyimide resin layer (i) containing not less than 70 mol% of structural units produced from 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl and pyromellitic dianhydride, and at least one layer is a polyimide resin layer (ii) having a low glass transition temperature and has a light transmittance of the polyimide film at a wavelength of 500 nm of not less than 75%, and a heat expansion coefficient of not greater than 30 ppm/K. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013075525(A) 申请公布日期 2013.04.25
申请号 JP20120263144 申请日期 2012.11.30
申请人 NIPPON STEEL & SUMIKIN CHEMICAL CO LTD 发明人 SUDO YOSHIKI;O KOEN
分类号 B32B27/34;C08G73/10;C08J5/18 主分类号 B32B27/34
代理机构 代理人
主权项
地址