发明名称 |
ELECTRONIC ASSEMBLY |
摘要 |
An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.
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申请公布号 |
US2013099269(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213712357 |
申请日期 |
2012.12.12 |
申请人 |
INTELLECTUAL DISCOVERY CO., LTD.;INTELLECTUAL DISCOVERY CO., LTD. |
发明人 |
LEE MENG E.;LIM SEONG CHOON;ONG ENG CHUAN |
分类号 |
H01L33/52;H01L33/48;H01L33/60 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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