发明名称 ELECTRONIC ASSEMBLY
摘要 An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.
申请公布号 US2013099269(A1) 申请公布日期 2013.04.25
申请号 US201213712357 申请日期 2012.12.12
申请人 INTELLECTUAL DISCOVERY CO., LTD.;INTELLECTUAL DISCOVERY CO., LTD. 发明人 LEE MENG E.;LIM SEONG CHOON;ONG ENG CHUAN
分类号 H01L33/52;H01L33/48;H01L33/60 主分类号 H01L33/52
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