| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves both the improvement of heat radiation efficiency and the reduction of the manufacturing cost. <P>SOLUTION: A semiconductor device has: a semiconductor chip 10 having an electrode surface on the surface side; a first wiring substrate 20 which is joined to the surface side of the semiconductor chip 10, electrically connects with an electrode of the semiconductor chip 10, and is provided with wiring for leading out electric potential thereof to the outer side relative to an outer periphery of the semiconductor chip 10; and a first support medium 30 joined to the rear surface side of the semiconductor chip through a joining material 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
