发明名称
摘要 The present invention provides an active metal brazing material composed of a Ag-Cu-Ti-Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn-Ti or Cu-Ti intermetallic compound dispersed in a Ag-Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and additionally the particle size of the intermetallic compound is 20 µm or less. The foregoing active metal brazing material improves the workability of the hitherto known Ag-Cu-Ti alloy active metal brazing material and enables a critical dimension processing with a high processing rate, and can be produced by melting and casting the foregoing Ag-Cu-Ti-Sn alloy, and by subsequently plastically working the cast at a working rate of 90% or more to make finer the intermetallic compound involved.
申请公布号 JP5189669(B2) 申请公布日期 2013.04.24
申请号 JP20110115593 申请日期 2011.05.24
申请人 发明人
分类号 B23K35/30;C04B37/00;C22C5/06;C22F1/00;C22F1/14 主分类号 B23K35/30
代理机构 代理人
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