| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder material which can be melted and joined at lower temperature conditions (peak temperature:≥150°C) than the mounting temperature (reflow heat treatment temperature)of Sn-37Pb eutectic solder, and can be repaired under the temperature conditions same as those of Sn-37Pb eutectic solder after the mounting. Ž<P>SOLUTION: The metal filler includes: first metal grains composed of an alloy having a composition containing, by mass, 5 to 15% Ag, 15 to 25% Bi, 10 to 20% Cu, 15 to 25% In and 15 to 55% Sn; and second metal grains composed of an alloy having a composition containing 25 to 40% Ag, 2 to 8% Bi, 5 to 15% Cu, 2 to 8% In and 29 to 66% Sn, and in which regarding the mixing ratio between the first metal grains and the second metal grains to the first metal grains 100 pts.mass, the ratio of the second metal grains is 90 to 110 pts.mass. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž |
