发明名称 |
Wet metal-etching method and apparatus for MEMS device fabrication |
摘要 |
The present invention provides a method of wet etching a silicon slice including a silicon substrate and a metal film layer thereon comprising steps of: performing lithographic process to the silicon slice forming a masked silicon slice comprising the silicon substrate and a partially masked metal film thereon; immersing the masked silicon slice into an etchant; rotating the masked silicon slice in the etchant; injecting high-purity nitrogen gas into the etchant for agitating the etchant; removing the masked silicon slice out of the etchant, upon completion of etching; and rinsing the masked silicon slice with deionized water. |
申请公布号 |
US8425718(B2) |
申请公布日期 |
2013.04.23 |
申请号 |
US20100724165 |
申请日期 |
2010.03.15 |
申请人 |
JIANG YADONG;WU ZHIMING;WANG TAO;LI WEIZHI;HAN XIAOLIN;UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA |
发明人 |
JIANG YADONG;WU ZHIMING;WANG TAO;LI WEIZHI;HAN XIAOLIN |
分类号 |
H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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