| 摘要 |
PURPOSE: A manufacturing method of printed circuit board in which the IC chip is built in is provided to reduce the manufacturing cost of the printed circuit board by directly contacting the contact pad of the IC chip to a terminal of core substrate. CONSTITUTION: A printed circuit board(101) includes a core substrate(111) and an outer layer substrate(121). Circuits(113,123) are altogether comprised on the core substrate and the outer layer substrate. The IC chip(141) is conversely stuck on the top of the core substrate. A glue layer(171) which seals up the IC chip is formed on the top of the core substrate. The IC chip is connected to the circuit of the outer layer substrate through the hall(131). |
