| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which the connection reliability is enhanced by improving the filling properties of a blind hole, formed by conformal method, with the filled via plating without increasing the material cost or the man-hour, and to provide a manufacturing method therefor. <P>SOLUTION: The wiring board has a blind hole 7 extending from the opening 10 of a surface layer copper foil 3 to an inner layer conductor 5 while penetrating a base material 4, and a filled via 14 which fills the blind hole 7 and connects the inner layer conductor 5 and the surface layer copper foil 3 electrically. The opening 10 of the surface layer copper foil is formed by enlarging the window hole 2 of the surface layer copper foil equal to or larger than the blind hole 7. A manufacturing method therefor is also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
