| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cover material which can be suitably used for a board using a thermoplastic liquid crystal polymer film and an LCP circuit board which comprises the cover material. <P>SOLUTION: A circuit board 10 is at least composed of a board structure 11 including a board 12 and a conductor circuit 13 provided on the surface on at least one side of the board 12 and a cover material 14 which covers at least the conductor circuit side among the outermost layers of the board structure 11. The board is formed from a film consisting of a thermoplastic polymer which is capable of forming an optically anisotropic molten phase. The cover material has (i) solder heat resistance at 260°C, (ii) dielectric constant of 2.0 to 3.5, and (iii) electrical loss tangent of 0.01 or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
