发明名称 WIRING STRUCTURE, METHOD FOR MANUFACTURING WIRING STRUCTURE, AND TOUCH PANEL
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring structure capable of achieving reduction in contact resistance and high visibility, a method for manufacturing the wiring structure, and a touch panel. <P>SOLUTION: The wiring structure includes: a transparent substrate 20; a pad part 60b formed on the transparent substrate 20; and a first transparent conductive pattern 30 that includes a binder electrically connected to the pad part 60b, and a conductive fiber. A weight ratio (conductive fiber/binder) of the conductive fiber to the binder is set larger in the contact area C1 between the pad part 60b and a connecting part 36 compared with an area other than the contact area C of the first transparent conductive pattern 30. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013073475(A) 申请公布日期 2013.04.22
申请号 JP20110212934 申请日期 2011.09.28
申请人 FUJIFILM CORP 发明人 MATSUNAMI YUKI;OBATA FUMIO;NAKAYAMA MASAYA;SATO YU
分类号 G06F3/041 主分类号 G06F3/041
代理机构 代理人
主权项
地址
您可能感兴趣的专利