| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package manufacturing method which can prevent performance deterioration caused by invasion by a foreign substance between a substrate and an encapsulation material or into a substrate. <P>SOLUTION: A semiconductor package manufacturing method of manufacturing a semiconductor package by using a holding jig 1 in which a pressure-sensitive adhesive sheet 3 having two adhesive sides is adhered to a support base material 2 in a manufacturing process of the semiconductor package, the method comprises: arranging, on a surface of the pressure-sensitive adhesive sheet 3 of the holding jig 1, a plurality of intermediate assemblies 25 for the semiconductor package in which a semiconductor chip 22 is mounted on a multilayered substrate 20 at intervals so as to be held by adhesion; integrally molding the plurality of intermediate assemblies 25 by a mold resin 26 to cover a region other than an undersurface 27 of each intermediate assembly 25; and removing the integrally molded plurality of intermediate assemblies 25 from the pressure-sensitive adhesive sheet 3 of the holding jig 1, and subsequently, dividing the integrally molded plurality of intermediate assemblies 25 between the intermediate assembly 25 and the intermediate assembly 25 adjacent to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
