发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To inhibit the occurrence of a problem that a substrate W is damaged when the substrate W is peeled from an adhesive sheet 5. <P>SOLUTION: A gas (nitrogen gas) is injected between an adhesive sheet 5 and a substrate W thereby peeling the substrate W from the adhesive sheet 5. Thus, the substrate W is peeled from the adhesive sheet 5 with a force of the injected gas (nitrogen gas), which is relatively dispersed and acts on the substrate W, without causing a large force to locally act on the substrate W. As a result, the structure inhibits the occurrence of a problem that the substrate W is damaged when the substrate W is peeled from the adhesive sheet 5. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013074125(A) 申请公布日期 2013.04.22
申请号 JP20110212219 申请日期 2011.09.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MIYA KATSUHIKO
分类号 H01L21/683 主分类号 H01L21/683
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