| 发明名称 |
SINGLE-LAYER METALLIZATION AND VIA-LESS METAMATERIAL STRUCTURES |
| 摘要 |
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures. |
| 申请公布号 |
KR20130039775(A) |
申请公布日期 |
2013.04.22 |
| 申请号 |
KR20137007687 |
申请日期 |
2008.10.13 |
| 申请人 |
RAYSPAN CORPORATION |
发明人 |
GUMMALLA AJAY;ACHOUR MAHA;LEE CHENG JUNG;PATHAK VANEET;POILASNE GREGORY |
| 分类号 |
H01Q5/01;H01Q1/38;H01Q21/00 |
主分类号 |
H01Q5/01 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
