| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide copper foil for electronic circuits capable of ensuring a uniform surface condition of the copper foil before etching so as to prevent pattern defects when forming a circuit by etching. <P>SOLUTION: Provided is copper foil for electronic circuits which is made of copper foil bonded to a resin substrate and is used to form circuits by etching. A Ni-Co alloy layer having a Co ratio ranging from 50 to 90% is formed on a surface, not bonded to the resin substrate, of the copper foil. <P>COPYRIGHT: (C)2013,JPO&INPIT |
