发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving operation speed and reducing power consumption, and a manufacturing method thereof. <P>SOLUTION: A semiconductor device comprises: a first element isolation insulating film for defining a first region on a semiconductor substrate; a first conductive layer of a first conductivity type formed on the first region of the semiconductor substrate; a semiconductor layer formed on the semiconductor substrate and having a second conductive layer of the first conductivity type formed by connecting the first conductive layer to a second region which is a part of the first region and a third conductive layer of the first conductivity type formed by connecting the first conductive layer to a third region which is the other part of the first region; a second element isolation insulating film provided in the semiconductor layer and isolating the second conductive layer and the third conductive layer; a gate insulating film formed on the second conductive layer; and a gate electrode electrically connected to the first conductive layer via the third conductive layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013074146(A) 申请公布日期 2013.04.22
申请号 JP20110212483 申请日期 2011.09.28
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 YOSHIDA EIJI
分类号 H01L21/336;H01L21/76;H01L21/762;H01L21/8234;H01L21/8238;H01L27/088;H01L27/092;H01L29/78;H01L29/786 主分类号 H01L21/336
代理机构 代理人
主权项
地址