发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving operation speed and reducing power consumption, and a manufacturing method thereof. <P>SOLUTION: A semiconductor device comprises: a first element isolation insulating film for defining a first region on a semiconductor substrate; a first conductive layer of a first conductivity type formed on the first region of the semiconductor substrate; a semiconductor layer formed on the semiconductor substrate and having a second conductive layer of the first conductivity type formed by connecting the first conductive layer to a second region which is a part of the first region and a third conductive layer of the first conductivity type formed by connecting the first conductive layer to a third region which is the other part of the first region; a second element isolation insulating film provided in the semiconductor layer and isolating the second conductive layer and the third conductive layer; a gate insulating film formed on the second conductive layer; and a gate electrode electrically connected to the first conductive layer via the third conductive layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013074146(A) |
申请公布日期 |
2013.04.22 |
申请号 |
JP20110212483 |
申请日期 |
2011.09.28 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
YOSHIDA EIJI |
分类号 |
H01L21/336;H01L21/76;H01L21/762;H01L21/8234;H01L21/8238;H01L27/088;H01L27/092;H01L29/78;H01L29/786 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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