发明名称 CHARGED PARTICLE BEAM LITHOGRAPHY DEVICE AND CHARGED PARTICLE BEAM LITHOGRAPHY METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a charged particle beam lithography device and a charged particle beam lithography method that can securely suppress a rise in temperature in a sub-deflection region when repetitive irradiation with a charged particle beam is caused as drawing patterns overlap in the sub-deflection region. <P>SOLUTION: A deflection control section 32 includes: a main deflection control section 32a which positions a predetermined sub-deflection region; a sub-deflection control section 32b which controls a predetermined shot position; an area counter 32c which sums up shot tare in the sub-deflection region to finds drawing area; and a determination section 32d which determines whether the drawing area exceeds a set value when drawing processing in the predetermined sub-deflection region is performed, and interrupts the drawing processing and makes the main deflection control part 32d position the predetermined sub-deflection region again and restart the drawing processing when the drawing area exceeds the set value. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013074190(A) 申请公布日期 2013.04.22
申请号 JP20110213149 申请日期 2011.09.28
申请人 NUFLARE TECHNOLOGY INC 发明人 HATTORI YOSHIAKI
分类号 H01L21/027 主分类号 H01L21/027
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