SEMICONDUCTOR CHIP PACKAGE, AND TAPE CARRIER PACKAGE FOR TRANSFERRING THE SAME

摘要

PURPOSE: A semiconductor chip package and a tape carrier package for transferring the same are provided to extend the lifetime of a chip and to prevent malfunction using a heat dissipation layer generated from the chip. CONSTITUTION: A metal layer(30) includes a lead connected to a chip bump on the lower surface of a chip(10). A through hole(52) is formed on a support layer(50) made of an insulating material. A heat dissipation layer(60) radiates the heat generated from the chip which is delivered to a metal layer to the outside. A resin insulating layer(40) is arranged between the chip and the support layer. A heat radiation part(70) covers the upper side of the chip. A heat radiation member(80) discharges the heat from the heat radiation part to the outside.