| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows improving the reliability with respect to the thermal stress of a solder joint portion to an electrode terminal and to provide the electrode terminal. <P>SOLUTION: The semiconductor device includes: a substrate 104; semiconductor chips 21A and 21B mounted on the substrate 104; an electrode 23 electrically connected to the semiconductor chips 21A and 21B; an electrode terminal 1 soldered to the electrode 23 and having one terminal 11 and the other terminal 12; and a case 200 covering the substrate 104, the semiconductor chips 21A and 21B, the electrode 23, and the terminals 11 and 12. In the electrode terminal 1, a flat-plate portion 10 formed in a flat-plate shape is exposed outside the case 200, and the terminal 11 and the terminal 12 are folded back so as to face toward the center of the case 200 and come close to each other to solder the electrode inside the case 200. <P>COPYRIGHT: (C)2013,JPO&INPIT |
