| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME |
| 摘要 |
A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package. |
| 申请公布号 |
US2013093076(A1) |
申请公布日期 |
2013.04.18 |
| 申请号 |
US201113272434 |
申请日期 |
2011.10.13 |
| 申请人 |
LIN WEI-HUNG;CHENG MING-DA;LIU CHUNG-SHI;LII MIRNG-JI;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN WEI-HUNG;CHENG MING-DA;LIU CHUNG-SHI;LII MIRNG-JI;YU CHEN-HUA |
| 分类号 |
H01L23/498;B23K1/20 |
主分类号 |
H01L23/498 |
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