MULTI-CHIP SEMICONDUCTOR PACKAGE AND FORMATION METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip semiconductor package and a formation method of the multi-chip semiconductor package.

SOLUTION: A first semiconductor chip 11 having a first protruding electrode 17 on its upper surface is prepared. A second semiconductor chip 21 having a second protruding electrode 27 is mounted on the first semiconductor chip so that the first protruding electrode is exposed. An insulation film 8 is formed between the first protruding electrode and the second protruding electrode. A groove 18G is formed in the insulation film. The groove is buried and interconnection 18, connecting with the first protruding electrode and the second protruding electrode, is formed.

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