发明名称 |
Process for Forming Package-on-Package Structures |
摘要 |
A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material.
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申请公布号 |
US2013093078(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201113275065 |
申请日期 |
2011.10.17 |
申请人 |
LIN CHIH-WEI;CHENG MING-DA;CHEN MENG-TSE;LU WEN-HSIUNG;HUANG KUEI-WEI;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN CHIH-WEI;CHENG MING-DA;CHEN MENG-TSE;LU WEN-HSIUNG;HUANG KUEI-WEI;LIU CHUNG-SHI |
分类号 |
H01L23/498;H01L23/522 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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