DEFECT INSPECTION DEVICE, COMPONENT MOUNTING SYSTEM, DEFECT INSPECTION METHOD AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a defect inspection device capable of exactly detecting the presence or the absence of defects on the basis of an image which is obtained by imaging a substrate.

SOLUTION: A solder area for a pad is calculated from each of print substrate image data which is obtained by imaging a substrate after a solder printing process and component mounting substrate image data which is obtained by imaging a substrate after a component mounting process. On the basis of change amounts in a solder area for a pad after the solder printing process and the component mounting process, determination is made as to whether a soldering defect occurs in a pad.

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