| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which, while keeping the emission of a light-emitting element and the fitting strength or package strength of a light-emitting device unaffected and also securing a sufficient bonding area, can be fabricated in a smaller size. <P>SOLUTION: A substrate 21 of the light-emitting device has 1/4 through-hole electrodes 26 to 29 formed thereon at both edges on each of opposite end sides 21a and 21b. Conductive patterns 34 and 35 are formed between the 1/4 through-hole electrodes at both edges on each end side. This construction ensures that a wiring bonding area faces the end sides of the substrate, and that obstacles are therefore nonexistent in the direction in which a capillary draws out a wire. As a result, the capillary can move to edges of the wire bonding area, allowing the conductive patterns to be used in full width, from corner to corner. Accordingly, it is possible to cut back 1/2 through-hole electrodes at edges of the substrate, and further to secure sufficient extent for wire bonding even when the wire bonding area is reduced in size. <P>COPYRIGHT: (C)2013,JPO&INPIT |
