FILM ADHESIVES AND PROCESSES FOR BONDING COMPONENTS USING SAME

摘要

Processes are provided for forming film adhesives (10). The processes include applying an adhesive (18), such as a Bisphenol A epoxy resin, to a membrane (14), and partially curing the adhesive (18). The resulting film adhesives (10) can be shipped and stored at room temperature. The film adhesives (10) can be used to bond components such as, but not limited to printed wireboards (11, 12) and other substrates. A structural bond between the components can be formed by fully curing the resin (18) while the resin (18) is in contact with at least one of the components.