| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure good heat radiation performance without impairing electric insulation properties of an insulation layer. <P>SOLUTION: A semiconductor device comprises: a plate like die pad 10 having conductivity; a semiconductor chip 20 fixed to one surface of the die pad; a conductive lead 30 which is formed into a band shape and electrically connects with the semiconductor chip at one end part in the longitudinal direction; a heat dissipation member 40 joined to the other surface of the die pad; and a mold resin 50 sealing the one end part of the lead, the die pad, and the semiconductor chip so that at least the other end part of the lead is exposed. The heat dissipation member has metal foil 41 joined to the other surface of the die pad through a joining material; a heat dissipation part 42 dissipating heat generated from the semiconductor chip, and an insulation layer 43 disposed between the heat dissipation part and the metal foil. <P>COPYRIGHT: (C)2013,JPO&INPIT |
